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Hermetic Packaging Market is expected to witness significant gains during 2020 – 2026

Author : Ravi Chawat | Published Date : 2020-09-03 

Global Hermetic packaging market is forecast to the cross USD 6 billion mark by 2026. Growing application of hermetic seals in various industry verticals, such as military & defense, aerospace, healthcare, automotive, electronics, and manufacturing industries is likely to drive global hermetic packaging market outlook.

Functionality of some products and appliances is disrupted by harsh environment and to preserve their functionality, hermetic seals are used. Hermetic packages find applications in semiconductors or in places where components need protection from pressure, electricity, or vacuum risks.

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In the healthcare sector, hermetic packaging is commonly utilized in implantable medical devices, such as micro-housings for miniature components in endoscopic applications, cardiac implants, pacemakers, defibrillators, and UV lasers for surgical drilling. Expansion of North American healthcare sector along with increasing expenditure on advanced medical services across the United States may result in product proliferation. In 2017, the medical device industry in the U.S. was the largest with over USD 150 billion and the U.S R&D investments for medical devices accounts for 7% of the sales revenue.

Configuration-wise, pressed ceramic packages is estimated to showcase a notable CAGR of above 6% over 2019-2026. This escalating growth rate can be attributed to the relatively low cost of the product as compared to multilayer ceramic packages.

Reed glass is forecast to generate a revenue of USD 400 million in hermetic packaging market share over the analysis period due to high reliability and excellent wear resistance of the product. Reed switches aid in opening and closing electrical systems without any external mechanical force and are primarily utilized in the automotive sector. Rapid expansion of the automotive sector along with growing demand for advanced features in vehicles may foster industry size.

MEMS (Microelectromechanical) switches are delicate and possess moving structures, which can be disrupted by the air or pressure in the environment, and hence require hermetic packaging. MEMS switches application segment is estimated to register an appreciable growth rate of around 8% over the forecast period.

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Key industry players operating in hermetic packaging market include SCHOTT AG, Materion Corporation, Texas Instruments, Teledyne Technologies, Willow, Renesas Electronics Corporation, Legacy Technologies, AMETEK.Inc., Micross, KYOCERA Corporation, EGIDE, Special Hermetic Prod., SGA Technologies, and Winchester Interconnect among others. These manufacturers are engaged in product innovation, strategic collaborations, and mergers for expanding their business operations to gain profitable growth.

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About Author

Ravi Chawat

Ravi Chawat

Ravi Chawat holds a bachelor's degree in Electronics and Telecommunication Engineering. He has worked closely with industry specialists from different segments including chemicals, food and beverages, construction and manufacturing & energy and power. Ravi's article concentrates principally on balancing relevant data but never at the expense of making the content engaging. He believes in giving fair-minded information to guide significant business choices. [email protected] | https://twitter.com/RaviChawat

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