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Molded Interconnect Devices Market Volume Analysis, Segments, Value Share and Key Trends 2020-2026

Author : Ronak Bora | Published Date : 2020-11-09 

It has been estimated that global molded interconnect devices market will be worth more than US$1 billion by 2026, with a positive application outlook in automotive, electronics, and industrial sector. Smartphones and smart wearables have gained immense popularity over the past decade. The deployment of MID into these gadgets helps improve circuit density and eliminate unnecessary components by combining circuit boards, cables, and connectors.

The greatest advantage of molded interconnect devices market perhaps is the minimal environmental impact. This can be associated with the use of recyclable thermoplastic materials in MID and the elimination of harmful flame retardation manufacturing process.

The presence of established automotive and electronics companies in Asia Pacific will be a major factor driving the demand for the technology. These companies are making substantial R&D efforts and investments in new product development. The region is also one of the leading markets of consumer electronics such as smartphones, laptops, routers and printers. Growing integration of MID antennas and circuitries into these devices will definitely complement the regional outlook.

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Laser direct structuring (LDS) process is prominently used by OEMs as it eliminates the need for harmful chemical pretreatment during metallization. It makes prototyping considerably faster and repeatable and by allowing manufacturers to reprogram the laser unit based on their need. Additionally, it offers a greater degree of design freedom and flexibility, reducing overall tooling costs.

LDS process segment is projected to witness a robust CAGR of 15% through 2026. The process offers additional features such as precise positioning, thin and double-sided module, reliable contacting, and efficient thermal management for high-power LEDs. Many emerging industry participants have implemented LPKF’s patented technology to deploy LDS and expand their molding capabilities.

The technology is gaining increasing prominence in the automotive sector as automakers explore ways to meet the safety and comfort needs of passengers. Automotive OEMs are also implementing the LDS to minimize the number of components in vehicles, resulting in lower manufacturing costs and a lighter end product.

List of the Key Companies that are Operating in the Molded Interconnect Devices Market. They are as follows:

Amphenol T&M Antennas, Galtronics, Harting Mitronics AG, LPKF Laser & Electronics AG, MacDermid Enthone, Molex, Multiple Dimensions AG, RTP Company, S2P smart plastic product, SelectConnect Technologies, Suzhou Cicor Technology Co. Ltd, TE Connectivity, Teprosa GmbH, Tongda Group, Yomura, Material Suppliers: BASF, DSM, EMS-GRIVORY, Ensinger GmbH, Division Ensinger Compounds, Evonik Industries, Lanxess, Mitsubishi Engineering Plastics, PTS Group, RTP, Sinoplast New Material Ltd., Zeon Corporation

Increased safety and comfort needs in passenger vehicles is accelerating the adoption of laser direct structuring in automotive engineering applications. Automotive OEMs are focusing on reducing the number of components in vehicles to cut manufacturing costs. MID technology is rapidly gaining traction in numerous industrial applications. It offers greater flexibility and reliability for operation in harsh environments.

The miniaturization of electronic components and semiconductors along with the availability of more compact sensors is enabling the implementation of molded interconnect device into industrial robots. In the medical industry, MIDs are being extensively deployed in equipment such as complex dental tools, reducing the overall size and weight of the equipment. Positive application scope in similar applications across numerous industry verticals will drive future molded interconnect devices market trends.

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Table Of Content:

Chapter 4   Molded Interconnect Devices Market, By Process

4.1   Key trends by process

4.2   Laser Direct Structuring (LDS)

4.2.1    Market estimates and forecast, 2015 - 2026

4.2.2    molded interconnect devices market estimates and forecast, by application, 2015 - 2026

4.3   Two-shot molding

4.3.1    Market estimates and forecast, 2015 - 2026

4.3.2    Market estimates and forecast, by application, 2015 - 2026

4.4   Others

4.4.1    Market estimates and forecast, 2015 - 2026

4.4.2    Market estimates and forecast, by application, 2015 - 2026

Chapter 5   Molded Interconnect Devices Market, By Application

5.1   Key trends by application

5.2   Automotive

5.2.1    Market estimates and forecast, 2015 - 2026

5.2.2    Market estimates and forecast, by process, 2015 - 2026

5.3   Consumer products

5.3.1    Market estimates and forecast, 2015 - 2026

5.3.2    Market estimates and forecast, by process, 2015 - 2026

5.4   Healthcare

5.4.1    Market estimates and forecast, 2015 - 2026

5.4.2    Market estimates and forecast, by process, 2015 - 2026

5.5   Industrial

5.5.1    Market estimates and forecast, 2015 - 2026

5.5.2    molded interconnect devices market estimates and forecast, by process, 2015 - 2026

5.6   Military & aerospace

5.6.1    Market estimates and forecast, 2015 - 2026

5.6.2    Market estimates and forecast, by process, 2015 - 2026

5.7   Telecommunication & computing

5.7.1    Market estimates and forecast, 2015 - 2026

5.7.2    Market estimates and forecast, by process, 2015 - 2026

5.8   Others

5.8.1    Market estimates and forecast, 2015 - 2026

5.8.2    Market estimates and forecast, by process, 2015 - 2026

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About Author

Ronak Bora

Ronak Bora

A graduate in Electronics Engineering, Ronak writes for fractovia and carries a rich experience in digital marketing, exploring how the online world works from a technical and marketing perspective. His other areas of interest include reading, music, and sport. [email protected] | https://twitter.com/RonakBora26

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